View BDJ0601HFV-TR_8680421.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com temperature sensor ics low current thermostat output bdjxxx1hfv series general description bdj xxx 1hfv series is a thermostat output temperature sensor ic with built-in temperature detection element, constant current circuit, and a high -accuracy reference voltage source in one chip. temperature detection can be realized at 2.5c accuracy without the need for a complicated design. it is the best suited for portable equipment of micro- and low-current, power down function, and battery drive. it is possible to use it for a wide range of applications such as heat detection and temperature monitors because it provides an analog output in addition to the thermostat power output. bdj xxx 1hfv series has 6 products at 60c, 70 c, 75 c, 80 c, 85 c and 90 c detection temperature. features ? de tection temperature lineup at 60c, 70 c, 75 c, 80 c, 85 c, 90c (6 products) ? built-in power down control function. (min pd interface voltage is 1.5v) ? low thermal resistance package (typ 187 c /w ) ? esd rating of 8kv (hbm) ? os output active h applications cellular phone, digital camera, thermal protection for electrical equipment (notebook pc, fpd-tv, etc.) key specifications ? power supply voltage range: 2.4v to 5.5v ? supply current: normal function mode 7.5 a (typ) power down mode 0.3 a (typ) ? high accuracy thermostat: 2.5c (max) @ta=60c to +90c ? sensing temperature hysteresis: 10.0c (typ) ? high accuracy analog output: 2.5c (max) @ta=- 30 c to +100c ? analog output temperature sensitivity: -8.2 mv/c (typ) ? operating temperature range: -30c to + 100 c package w(typ) x d(typ) x h(max) typical application circuit please adjust bypass capacitor according to the noise condition of the set. please pull- up of over 10k for the os output terminal. 1 2 3 4 please adjust capacitor according to the noise condition of the set. 5 temp gnd pd vref temp sensor vdd os iref + - pd 0.1f 1f hvsof5 1.60 mm x 1.60mm x 0.60 mm datashee t datashee t downloaded from: http:///
bdjxxx1hfv series 2/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 block diagram and pin configuration pin descriptions pin no. pin name function comment 1 temp output voltage in inverse proportion to the temperature set to open state or connect to a high input impedance node (over 10m). 2 gnd ground 3 pd power down control h: normal function mode l: power down mode h: thermostat and analog output operation. l: power down state. 4 os digital thermostat output open-drain active-high. use pull-up resistor of more than 10k . 5 vdd power supply voltage top view gnd temp pd vref temp sensor vdd os iref 1 2 3 5 4 pd downloaded from: http:///
bdjxxx1hfv series 3/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta = 25 c ) parameter symbol rating unit power supply voltage v dd -0.3 to +7.0 (note 1) v input voltage (pd) v in -0.3 to +v dd +0.3 v os terminal voltage v os -0.3 to +7.0 (note 1) v os terminal cu rrent i os 5.0 ma power dissipation pd 0.53 (note 2) w storage temperature range tstg -55 to +150 c (note 1) however, not exceeding pd. (note 2) when mounted on rohm standard board, derate by 5.36mw/ c for ta higher than 25 c. caution : operating the ic over the absolute maximum ratings may dam age the ic. the damage can either be a short circuit between p ins or an open circuit between pins and the internal circuitry. therefore, it is important to consider cir cuit protection measures, such as adding a fuse, in case the ic is operated ove r the absolute maximum ratings. recommended operating condition s parameter symbol rating unit min typ max power supply voltage v dd 2.4 2.8 5.5 v operating temperature range topr - 30 - + 100 c electrical characteristics (unless otherwise specified, v dd = 2.8v, ta = 25 c ) parameter symbol limit unit conditions min typ max supply current normal function mode i dd - 7.5 12.0 a pd="h" power down mode i ddpd - 0.3 1.0 a pd="l" pd input l voltage v il gnd - 0.2 v input h voltage v ih 1.5 - v dd v pd leakage current i lpd - - 1.0 a pd=2.8v analog output temp output voltage v temp 1.279 1.300 1.321 v ta = 30 c temp temperature sensitivity v se -8.00 -8.20 -8.40 mv/ c ta = -30c to +100c temp l oad re gulation ? v temprl - - 1.0 mv difference of i out : 0a / 2a temp vdd regulation ? v tempvdd - - 4.0 mv v dd =2.4v to 5.5v os output open drain o s leakage current i l - - 1.0 a v os =5.0v o s output voltage v ol - - 0.4 v i os = 1.0ma radiation hardiness is not designed. temperature accuracy (unless otherwise specified, v dd = 2.8v) parameter symbol limit unit conditions min typ max thermostat sensing temperature accuracy tacc - - 2.5 c sensing temperature hysteresis thys 7.5 10.0 12.5 c analog output temp temperature accuracy t temp - - 2.5 c v dd = 2.8v ta = -30c to +100c downloaded from: http:///
bdjxxx1hfv series 4/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 0.0 0.5 1.0 1.5 2.0 0 1 2 3 4 5 6 7 vdd [v] vtemp [v] figure 2. temp voltage vs supply voltage typical performance curves 0 5 10 15 0 1 2 3 4 5 6 7 vdd [v] idd [ a] ta=30c pd="h" pd="l" figure 1. supply current vs supply voltage ta=30c supply voltage : v dd [v] supply voltage : v dd [v] -12 -10 -8 -6 -4 -2 0 2 0 1 2 3 4 5 iout [ua] Svtemp [mv] v dd =2.8v, ta=30c figure 4. temp voltage vs output current output voltage : i out [a] supply current : i dd [a] temp voltage : v temp [v] 0.0 0.5 1.0 1.5 2.0 -40 -20 0 20 40 60 80 100 temp[] vtemp[v] v dd =2.8v figure 3. temp voltage vs temperature temperature : ta [c] temp voltage : v temp [v] ? temp voltage : ? v temp [v] downloaded from: http:///
bdjxxx1hfv series 5/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves C continued 0 0.2 0.4 0.6 0.8 0 1 2 3 4 5 i os [ma] v ol [v] v dd =2.8v, ta=25c figure 5. os output voltage vs load current load current : i os [ma] os output voltage : v ol [v] downloaded from: http:///
bdjxxx1hfv series 6/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 application information 1. function diagram (ex. 80 c detect active C h type bdj0801hfv) the internal ic temperature sensor senses temperature. temp terminal output voltage is converted to temperature. v temp value is 1.300[v] at ta = 30[c]. the value of v temp voltage reduction is inversely proportional to the temperature a t a rate of -8.2mv/c. if the temperature exceeds the detect point temperature, the inte rnal comparator forces the os output to change from l to h . (ex. active -h type) os returns to l when the t emperature becomes 10c lower than the detect point temperature. 0 2.0 analog temp. sensor output [v] os output voltage (v os ) [v] 1.0 v os v temp @30 c (1.3 00 v) temperature sensitivity (-8.20mv/c typ) detect point temperature hysteresis ( 10 c typ) temperature [ c ] 1.5 2.5 3.0 0.5 110 90 70 50 10 130 - 30 30 - 10 - 50 downloaded from: http:///
bdjxxx1hfv series 7/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 2. operation sequence (ex.80c detect active- h type bdj0801hfv) bdj0801hfv operation starts after pd h input. please refer to the os terminal signal table below for the wait time after pd h input. ta symbol wait time under detect temp. t os _l 200s over detect temp. t os _h 1000s vdd hi z(pull- up ) hi z hi z 1.300v@ta=30c 0.3a 0.3a 7.5a l level 0.2v pd i dd temp os time 70 c 80 c ref voltage h level 1.5v hi z hi z 7.5a 0.3a hi z t os _l t os _h hi z downloaded from: http:///
bdjxxx1hfv series 8/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 i/o equivalent circuits pd os temp vdd gnd use pull-up resistor of more than 10k . gnd os pd gnd vdd temp downloaded from: http:///
bdjxxx1hfv series 9/ 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both sma ll -signal and large-current ground traces, the two ground traces s hould be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on a ppl ication boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
bdjxxx1hfv series 10 / 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small ch arge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) should be avoided. figure 6. example of monolithic ic structure n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
bdjxxx1hfv series 11 / 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d j x x x 1 h f v - t r detect temp. 090: 90 c 0 85 : 85 c 0 80 : 80 c 0 75 : 75 c 0 70 : 70 c 0 60 : 60 c output format 1 : active-h package hfv:hvsof5 packaging and forming specification tr : embossed tape and reel lineup product name detect temp. (c) os output fo rmat product name detect temp. (c) os output format bdj0901hfv 90 open drain active h bdj0751hfv 75 open drain active h bdj0851hfv 85 open drain active h bdj0701hfv 70 open drain active h bdj0801hfv 80 open drain active h bdj0601hfv 60 open drain active h marking diagram orderable part number part number marking bdj0901hfv- tr gd bdj0 851 hfv- tr ge bdj0 801 hfv- tr gf bdj0 751 hfv- tr gg bdj0 701 hfv- tr gh bdj0 601 hfv- tr gm hvsof5 (top view) part number marking lot number downloaded from: http:///
bdjxxx1hfv series 12 / 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name hvsof5 downloaded from: http:///
bdjxxx1hfv series 13 / 13 tsz02201-0m2m0f515120-1-2 ? 20 15 rohm co., ltd. all rights reserved. 06.nov.2015 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 06.nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BDJ0601HFV-TR

	To Download BDJ0601HFV-TR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .